发明授权
- 专利标题: Method for producing a semiconductor component
- 专利标题(中): 半导体部件的制造方法
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申请号: US13407731申请日: 2012-02-28
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公开(公告)号: US08993372B2公开(公告)日: 2015-03-31
- 发明人: Manfred Schneegans , Carsten Ahrens , Adolf Koller , Gerald Lackner , Anton Mauder , Hans-Joachim Schulze
- 申请人: Manfred Schneegans , Carsten Ahrens , Adolf Koller , Gerald Lackner , Anton Mauder , Hans-Joachim Schulze
- 申请人地址: AT Villach
- 专利权人: Infineon Technologies Austria AG
- 当前专利权人: Infineon Technologies Austria AG
- 当前专利权人地址: AT Villach
- 代理机构: SpryIP, LLC
- 优先权: DE102011012721.6 20110301
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L21/36 ; H01L21/02 ; H01L21/762 ; H01L29/861
摘要:
Exemplary embodiments of a method for producing a semiconductor component having a polycrystalline semiconductor body region are disclosed, wherein the polycrystalline semiconductor body region is produced between the first and second surfaces of the semiconductor body in a semiconductor component section, wherein an electromagnetic radiation having a wavelength of at least 1064 nm is introduced into the semiconductor body in a manner focused onto a position in the semiconductor component section of the semiconductor body and wherein the power density of the radiation at the position is less than 1×108 W/cm2.
公开/授权文献
- US20120225544A1 Method for producing a semiconductor component 公开/授权日:2012-09-06
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