发明授权
- 专利标题: Laser processing method and device
- 专利标题(中): 激光加工方法及装置
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申请号: US10585451申请日: 2004-12-13
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公开(公告)号: US08993922B2公开(公告)日: 2015-03-31
- 发明人: Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
- 申请人: Kazuhiro Atsumi , Koji Kuno , Masayoshi Kusunoki , Tatsuya Suzuki
- 申请人地址: JP Hamamatsu-shi, Shizuoka
- 专利权人: Hamamatsu Photonics K.K.
- 当前专利权人: Hamamatsu Photonics K.K.
- 当前专利权人地址: JP Hamamatsu-shi, Shizuoka
- 代理机构: Drinker Biddle & Reath LLP
- 优先权: JPP2004-004312 20040109
- 国际申请: PCT/JP2004/018591 WO 20041213
- 国际公布: WO2005/065880 WO 20050721
- 主分类号: B23K26/14
- IPC分类号: B23K26/14 ; B23K26/00 ; B23K26/04 ; B23K26/40
摘要:
A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam is provided.This laser processing method comprises a displacement acquiring step (S07 to S11) of irradiating an object to be processed with a rangefinding laser beam for measuring a displacement of a main surface of the object while converging the laser beam with a lens and acquiring the displacement of the main surface along a line to cut while detecting reflected light reflected by the main surface in response to the irradiation; and moves the processing objective lens and the object relative to each other along the main surface, while adjusting the gap between the processing objective lens and the surface according to the displacement acquired by the displacement acquiring step, thereby forming the modified region along the line to cut.
公开/授权文献
- US20080037003A1 Laser Processing Method And Device 公开/授权日:2008-02-14
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