A mechanism for electrically coupling a semiconductor device die to a semiconductor device package substrate that avoids introduction of excessive temperature induced stresses to the semiconductor device die interconnect is provided. In one embodiment, the semiconductor device die is mechanically attached to the package substrate (or another semiconductor device die) at room temperature through the use of a plug-in socket or wedge connection having corresponding mating features formed on the die and substrate. The mechanical interconnect features can be formed on the die and substrate interconnects using an electroplating process. The surfaces of the semiconductor device die and package substrate can then be coupled using an underfill material. A low-temperature solid state bonding process can then be used to diffuse the materials forming the plug and socket features in order to form the electrical connection.