Invention Grant
- Patent Title: Molded image sensor package and method
- Patent Title (中): 成型图像传感器封装和方法
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Application No.: US13350619Application Date: 2012-01-13
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Publication No.: US08994860B2Publication Date: 2015-03-31
- Inventor: Steven Webster
- Applicant: Steven Webster
- Assignee: Amkor, Technology, Inc.
- Current Assignee: Amkor, Technology, Inc.
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H04N5/335
- IPC: H04N5/335 ; H04N5/225 ; G02B7/02 ; H01L27/146 ; H01L31/0203 ; H01L31/0232 ; H01L23/00

Abstract:
An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
Public/Granted literature
- US20120112042A1 MOLDED IMAGE SENSOR PACKAGE AND METHOD Public/Granted day:2012-05-10
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