发明授权
- 专利标题: Integrated circuit package with molded cavity
- 专利标题(中): 具有模腔的集成电路封装
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申请号: US13463148申请日: 2012-05-03
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公开(公告)号: US08999754B2公开(公告)日: 2015-04-07
- 发明人: Seng Guan Chow , Il Kwon Shim , Byung Joon Han
- 申请人: Seng Guan Chow , Il Kwon Shim , Byung Joon Han
- 申请人地址: SG Singapore
- 专利权人: STATS ChipPAC Ltd.
- 当前专利权人: STATS ChipPAC Ltd.
- 当前专利权人地址: SG Singapore
- 代理机构: Ishimaru & Associates LLP
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L23/02 ; H01L23/31 ; H01L25/16 ; H01L23/50 ; H01L23/00
摘要:
An integrated circuit package system includes a base substrate, attaching a base die over the base substrate, attaching an integrated interposer having interposer circuit devices, over the base die, and forming a package system encapsulant having an encapsulant cavity over the integrated interposer.
公开/授权文献
- US20120217659A1 INTEGRATED CIRCUIT PACKAGE WITH MOLDED CAVITY 公开/授权日:2012-08-30