A package on package structure includes a connection substrate having a main body and electrically conductive posts, the main body includes a first surface and an opposite second surface, and each electrically conductive post passes through the first and second surfaces, and each end of the two ends of the electrically conductive post protrudes from the main body; a first package device arranged on a side of the first surface of the connection substrate; a package adhesive arranged on a side of the second surface of the connection substrate; and a second package device arranged on a side of the package adhesive furthest away from the first package device.