公开(公告)号：US12238852B2

公开(公告)日：2025-02-25

申请号：US18089005

申请日：2022-12-27

Applicant: Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  GARUDA TECHNOLOGY CO., LTD.

Inventor： Ying Wang ,  Yong-Chao Wei

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H05K3/42

Abstract: A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.

公开(公告)号：US20250056725A1

公开(公告)日：2025-02-13

申请号：US18458566

申请日：2023-08-30

Applicant: HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Ltd. ,  Garuda Technology Co., Ltd.

Inventor： Xiao-Juan ZHANG ,  Gang YUAN

IPC: H05K1/16 ,  H05K3/42

Abstract: A circuit board with embedded resistors and a method for fabricating the same are provided. The circuit board includes the circuit substrate and the variable resistor region. The variable resistor region includes the first resistor layer, the second resistor layer and the liquid metal material. The first resistor layer is electrically connected to the circuit substrate, and the second resistor layer overlaps the first resistor layer. The liquid metal material is located on and is electrically connected to the first resistor layer. The liquid metal material is spaced from the second resistor layer without any electrical connection under the initial temperature. The liquid metal material is electrically connected to the second resistor layer under the first temperature which is higher than the initial temperature.

公开(公告)号：US20240196541A1

公开(公告)日：2024-06-13

申请号：US18425373

申请日：2024-01-29

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited .

Inventor： CHENG-JIA LI ,  Mei Yang

IPC: H05K3/00 ,  H05K3/10 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/0097 ,  H05K3/0026 ,  H05K3/465 ,  H05K3/107 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/4053 ,  H05K3/4076 ,  H05K2201/0108 ,  H05K2201/0323 ,  H05K2203/0152 ,  H05K2203/1572

Abstract: A transparent circuit board includes a conductive wiring, a transparent insulating layer, and a cover film stacked on the transparent insulating layer. The conductive wiring penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the conductive wiring. A blackened layer is formed on a surface of the conductive wiring combined with the cover film, a carbon black layer is formed on a surface of the conductive wiring without the blackened layer, thereby improving a light transmittance of the transparent circuit board.

公开(公告)号：US11950371B2

公开(公告)日：2024-04-02

申请号：US16966118

申请日：2019-08-22

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

Inventor： Cheng-Jia Li ,  Mei Yang

IPC: H05K3/00 ,  H05K3/10 ,  H05K3/46 ,  H05K3/38 ,  H05K3/40

CPC classification number: H05K3/0097 ,  H05K3/0026 ,  H05K3/465 ,  H05K3/107 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/4053 ,  H05K3/4076 ,  H05K2201/0108 ,  H05K2201/0323 ,  H05K2203/0152 ,  H05K2203/1572

Abstract: A method for manufacturing a transparent circuit board includes the following steps. A composite substrate including a conductive layer and a transparent insulating layer on the conductive layer is provided. A wiring groove is formed on the transparent insulating layer by laser ablation and a carbon black layer is formed on an inner wall of the wiring groove. The wiring groove penetrates the transparent insulating layer, the wiring groove extends toward the conductive layer to pass through a part of the conductive layer. A conductive wiring corresponding to the wiring groove is formed and fully fills the wiring groove. A black oxide treatment is performed on a surface of the conductive wiring facing away from the conductive layer to form a blackened layer. A transparent cover film is pressed on a side of the transparent insulating layer facing away from the conductive layer. The conductive layer is removed.

公开(公告)号：US11871526B2

公开(公告)日：2024-01-09

申请号：US17672980

申请日：2022-02-16

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

Inventor： Jun Dai

IPC: H05K1/02 ,  H01L23/06 ,  H01F27/22 ,  H01F27/29 ,  H01F27/32 ,  H01F27/255 ,  H05K3/46 ,  H05K1/03 ,  H05K3/00 ,  H05K3/18

CPC classification number: H05K3/467 ,  H05K1/0298 ,  H05K1/0313 ,  H05K3/0023 ,  H05K3/188 ,  H05K2203/06 ,  H05K2203/0723

Abstract: A circuit board includes a substrate, a first circuit layer, a second circuit layer, and a third circuit layer. The substrate includes a base layer, a first metal layer formed on the base layer, and a seed layer formed on the first metal layer. The first circuit layer is located on the substrate and includes the first metal layer and a signal layer formed on a surface of the first metal layer. The second circuit layer is coupled to the first circuit layer and includes the first metal layer, the seed layer, and a connection pillar formed on a surface of the first metal layer and the seed layer. The third circuit layer is coupled to the second circuit layer and includes the seed layer and a coil formed on a surface of the seed layer.

公开(公告)号：US20230345643A1

公开(公告)日：2023-10-26

申请号：US17824020

申请日：2022-05-25

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

Inventor： CHIH-CHIEH FU ,  YUAN-YU LIN ,  ZE-JIE LI

IPC: H05K3/42 ,  H05K3/34 ,  H05K3/46 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K3/429 ,  H05K3/3494 ,  H05K3/4644 ,  H05K1/181 ,  H05K1/183 ,  H05K1/116 ,  H01L24/16

Abstract: A method for manufacturing a fan-out chip packaging structure with decreased use of a crack-inducing hot-soldering process includes a first carrier plate with first and a second outer wiring layers. Two first conductive posts are formed on the first outer wiring layer, one end of each post is electrically connected to the first outer wiring layer. A receiving groove is formed between first conductive posts, and a sidewall of each post is surrounded by a first insulating layer. An embedded component is laid in the receiving groove and a second carrier plate is formed on the first insulating layer, wherein the second carrier plate carries third and fourth outer wiring layers. A first outer component is connected to the second outer wiring layer, and a second outer component is connected to the fourth outer wiring layer.

公开(公告)号：US20230199966A1

公开(公告)日：2023-06-22

申请号：US17679554

申请日：2022-02-24

Applicant: Avary Holding (Shenzhen) Co., Ltd. ,  HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd. ,  Garuda Technology Co., Ltd.

Inventor： Zi-Qiang GAO ,  Xian-Qin HU

IPC: H05K1/18 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K3/4644 ,  H05K2201/0154

Abstract: A circuit board with embedded components and a method of fabricating the same are provided. The method includes coating an adhesive layer over a substrate, and disposing electronic components on the adhesive layer. Subsequently, after disposing a dielectric layer over the electronic components and the adhesive layer, the substrate and the adhesive layer are removed to form an embedded layer. Then, a wiring layer is formed on the electronic components, and conductive connecting components are formed within the dielectric layer. A cover layer is laminated over the dielectric layer and the wiring layer. Therefore, the electronic components are embedded within the dielectric layer, and the wiring layer electrically connecting to the electronic components are precisely located on a surface of the embedded layer.

公开(公告)号：US20230171876A1

公开(公告)日：2023-06-01

申请号：US17564995

申请日：2021-12-29

Applicant: Avary Holding (Shenzhen) Co., Ltd. ,  HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd. ,  Garuda Technology Co., Ltd.

Inventor： Zhi-Hong YANG ,  Mao-Feng HSU

IPC: H05K1/02 ,  H01L23/552 ,  H05K3/46

CPC classification number: H05K1/0218 ,  H01L23/552 ,  H05K3/4644

Abstract: The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and first shielding columns. The core layer includes an accommodating space, and the accommodating space has an inner side wall. The first shielding ring wall is disposed in the accommodating space and covers the inner side wall, in which the first shielding ring wall surrounds the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The second circuit layer is disposed between the first insulating layer and the core layer. The first shielding columns are disposed in the first insulating layer.

公开(公告)号：US20220312598A1

公开(公告)日：2022-09-29

申请号：US17418551

申请日：2020-01-21

Applicant: Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

Inventor： HSIAO-TING HSU ,  MING-JAAN HO ,  FU-YUN SHEN

IPC: H05K3/30 ,  H05K1/18 ,  H05K1/03 ,  H05K1/09

Abstract: A method for manufacturing a circuit board (100) includes: providing a first single-sided circuit substrate (20) including an insulating base layer (11) and a circuit layer (13); forming first conductive posts (111) electrically connected to the circuit layer (13) in the insulating base layer (11) to obtain a second single-sided circuit substrate (13); providing a first adhesive layer (40), forming second conductive posts (401); providing one second single-sided circuit substrate (30), defining a receiving groove (31) to obtain a third single-sided circuit substrate (50); providing another first single-sided circuit substrate (20), mounting an electronic component (14) on the circuit layer (13) to obtain a surface mounted circuit substrate (60); stacking the first single-sided circuit substrate (20), the first adhesive layer (40), the second single-sided circuit substrate (30), at least one of the third single-sided circuit substrate (50), and the surface mounted circuit substrate (60) in that order; pressing the intermediate body (70).

公开(公告)号：US11304312B2

公开(公告)日：2022-04-12

申请号：US16887473

申请日：2020-05-29

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

Inventor： Hao-Yi Wei ,  Yan-Lu Li

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/28

Abstract: A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.