发明授权
- 专利标题： Package systems having an opening in a substrate thereof and manufacturing methods thereof
- 专利标题（中）： 在其基材中具有开口的封装体系及其制造方法
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申请号： US12900718申请日： 2010-10-08
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公开(公告)号： US09000578B2公开(公告)日： 2015-04-07
- 发明人: Chia-Pao Shu , Chun-wen Cheng , Kuei-Sung Chang
- 申请人： Chia-Pao Shu , Chun-wen Cheng , Kuei-Sung Chang
- 申请人地址： TW
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW
- 代理机构： Lowe Hauptman & Ham, LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; B81C1/00 ; H01L23/00 ; H01L25/065
摘要：
A package system includes a first substrate and a second substrate. The second substrate is electrically coupled with the first substrate. The second substrate includes at least one first opening. At least one electrical bonding material is disposed between the first substrate and the second substrate. A first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening.
公开/授权文献
- US20120086126A1 PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF 公开/授权日：2012-04-12
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