发明授权
- 专利标题: Heat pump apparatus using supercooling degree to control expansion valve
- 专利标题(中): 热泵装置采用过冷度控制膨胀阀
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申请号: US12890270申请日: 2010-09-24
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公开(公告)号: US09003819B2公开(公告)日: 2015-04-14
- 发明人: Atsushi Itagaki , Takashi Sugiyama , Toshiyuki Fuji
- 申请人: Atsushi Itagaki , Takashi Sugiyama , Toshiyuki Fuji
- 申请人地址: JP Kawasaki
- 专利权人: Fujitsu General Limited
- 当前专利权人: Fujitsu General Limited
- 当前专利权人地址: JP Kawasaki
- 代理机构: Venable LLP
- 代理商 Michael A. Sartori; Tamatane J. Aga
- 优先权: JP2009-225954 20090930; JP2009-237875 20091015
- 主分类号: F25B41/04
- IPC分类号: F25B41/04 ; F25B13/00 ; F24D3/18 ; F25B31/00
摘要:
A heat pump apparatus includes: a refrigerant circuit which includes a compressor, an utilization-side heat exchanger, a first expansion valve, and an outdoor heat exchanger; an injection pipe which includes a solenoid switching valve and a second expansion valve; and an objective supercooling degree table which stores objective supercooling degrees according to condensing pressure in the refrigerant circuit and rotation number of the compressor. In the heat pump apparatus, liquid refrigerant is injected to the compressor by way of the injection pipe. The heat pump apparatus switches between a first case where the liquid refrigerant is injected to the compressor and a second case where the liquid refrigerant is not injected, and a value of the objective supercooling degree is changed between the first case and the second case to control the first expansion valve based on the value of the objective supercooling degree.
公开/授权文献
- US20110072840A1 HEAT PUMP APPARATUS 公开/授权日:2011-03-31
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