Invention Grant
- Patent Title: High voltage hybrid polymeric-ceramic dielectric capacitor
- Patent Title (中): 高压混合聚合陶瓷电介质电容器
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Application No.: US14504938Application Date: 2014-10-02
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Publication No.: US09006074B2Publication Date: 2015-04-14
- Inventor: Thomas Dyer Bonifield , Byron Williams , Shrinivasan Jaganathan
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Frank Cimino
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L49/02 ; H01L29/06 ; H01L21/768 ; H01L23/522

Abstract:
An integrated circuit includes isolation capacitors which include a silicon dioxide dielectric layer and a polymer dielectric layer over the layer of silicon dioxide. The silicon dioxide dielectric layer and the polymer dielectric layer extend across the integrated circuit. Top plates of the isolation capacitors have bond pads for wire bonds or bump bonds. Bottom plates of the isolation capacitors are connected to components of the integrated circuit. Other bond pads are connected to components in the integrated circuit through vias through the silicon dioxide dielectric layer and the polymer dielectric layer.
Public/Granted literature
- US20150044848A1 HIGH VOLTAGE HYBRID POLYMERIC-CERAMIC DIELECTRIC CAPACITOR Public/Granted day:2015-02-12
Information query
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