发明授权
US09006879B2 Semicondutor device package placed within fitting portion of wiring member and attached to heat sink
有权
半导体器件封装放置在布线构件的嵌合部分内并连接到散热器
- 专利标题： Semicondutor device package placed within fitting portion of wiring member and attached to heat sink
- 专利标题（中）： 半导体器件封装放置在布线构件的嵌合部分内并连接到散热器
-
申请号： US12908500申请日： 2010-10-20
-
公开(公告)号： US09006879B2公开(公告)日： 2015-04-14
- 发明人: Masaki Kato , Masahiko Fujita , Kazuyasu Sakamoto
- 申请人： Masaki Kato , Masahiko Fujita , Kazuyasu Sakamoto
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Electric Corporation
- 当前专利权人： Mitsubishi Electric Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2010-093925 20100415
- 主分类号： H01L23/40
- IPC分类号： H01L23/40 ; H05K1/02 ; H01L23/36 ; H05K1/18
摘要：
The invention is to provide a semiconductor apparatus configured to position a semiconductor device reliably and easily without having a protruding portion formed in the bottom surface of the semiconductor device in the semiconductor apparatus. A semiconductor apparatus is fabricated by attaching a semiconductor device of a surface mount package type and a wiring member to a heat sink. A fitting portion in which the semiconductor device is fit is provided to the wiring member, so that the semiconductor device is positioned by fitting the semiconductor device into the fitting portion provided to the wiring member. According to the semiconductor apparatus of the invention, it becomes possible to position the semiconductor device at a high degree of accuracy.
公开/授权文献
- US20110254148A1 SEMICONDUCTOR APPARATUS 公开/授权日：2011-10-20
信息查询
IPC分类:
