Invention Grant
US09007165B2 Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration 有权
基板装置或封装,采用垂直开关配置的可切换电介质材料的嵌入层

Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
Abstract:
A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.
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