Invention Grant
- Patent Title: Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
- Patent Title (中): 基板装置或封装,采用垂直开关配置的可切换电介质材料的嵌入层
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Application No.: US13524776Application Date: 2012-06-15
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Publication No.: US09007165B2Publication Date: 2015-04-14
- Inventor: Lex Kosowsky , Robert Fleming , Bhret Graydon
- Applicant: Lex Kosowsky , Robert Fleming , Bhret Graydon
- Applicant Address: US IL Chicago
- Assignee: Littelfuse, Inc.
- Current Assignee: Littelfuse, Inc.
- Current Assignee Address: US IL Chicago
- Agency: Kacvinsky Daisak Bluni PLLC
- Main IPC: H01C7/10
- IPC: H01C7/10 ; H05K1/02 ; H05K1/03

Abstract:
A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.
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