Invention Grant
US09009958B2 Systems and methods for encapsulating electronics in a mountable device
有权
将电子元件封装在可安装设备中的系统和方法
- Patent Title: Systems and methods for encapsulating electronics in a mountable device
- Patent Title (中): 将电子元件封装在可安装设备中的系统和方法
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Application No.: US14034303Application Date: 2013-09-23
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Publication No.: US09009958B2Publication Date: 2015-04-21
- Inventor: James Etzkorn
- Applicant: Google Inc.
- Applicant Address: US CA Mountain View
- Assignee: Google Inc.
- Current Assignee: Google Inc.
- Current Assignee Address: US CA Mountain View
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: H05K3/30
- IPC: H05K3/30 ; A61B5/145 ; G01N27/327 ; C12Q1/00 ; G02B1/04 ; G02C7/04 ; A61B5/1473 ; A61B5/00 ; H05K3/32 ; H05K1/18 ; A61B5/1477

Abstract:
A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure includes an electronic component having electrical contacts, sensor electrodes, and electrical interconnects between the sensor electrodes and the electrical contacts. The bio-compatible structure is fabricated such that it is fully encapsulated by a bio-compatible material, except for the sensor electrodes. In the fabrication, the electronic component is positioned on a first layer of bio-compatible material and a second layer of bio-compatible material is formed over the first layer of bio-compatible material and the electronic component. The electrical contacts are exposed by removing a portion of the second layer, a conductive pattern is formed to define the sensor electrodes and electrical interconnects, and a third layer of bio-compatible material is formed over the conductive pattern. The sensor electrodes are exposed by removing a portion of the third layer.
Public/Granted literature
- US20140296674A1 Systems and Methods for Encapsulating Electronics in a Mountable Device Public/Granted day:2014-10-02
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