发明授权
- 专利标题： Solder joint reflow process for reducing packaging failure rate
- 专利标题（中）： 焊接回流工艺，降低包装故障率
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申请号： US12987702申请日： 2011-01-10
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公开(公告)号： US09010617B2公开(公告)日： 2015-04-21
- 发明人: Chen-Hua Yu , Wen-Yao Chang , Chien Rhone Wang , Kewei Zuo , Chung-Shi Liu
- 申请人： Chen-Hua Yu , Wen-Yao Chang , Chien Rhone Wang , Kewei Zuo , Chung-Shi Liu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： B23K31/02
- IPC分类号： B23K31/02 ; H01L21/44 ; H01L23/00
摘要：
In a reflow process, a plurality of solder bumps between a first workpiece and a second workpiece is melted. During a solidification stage of the plurality of solder bumps, the plurality of solder bumps is cooled at a first cooling rate. After the solidification stage is finished, the plurality of solder bumps is cooled at a second cooling rate lower than the first cooling rate.
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