Invention Grant
- Patent Title: Nanocomposites with high thermoelectric figures of merit
- Patent Title (中): 具有高热值性能的纳米复合材料
-
Application No.: US13623459Application Date: 2012-09-20
-
Publication No.: US09011763B2Publication Date: 2015-04-21
- Inventor: Gang Chen , Mildred Dresselhaus , Zhifeng Ren
- Applicant: Massachusetts Institute of Technology , The Trustees of Boston College
- Applicant Address: US MA Cambridge US MA Chestnut Hill
- Assignee: Massachusetts Institute of Technology,Trustees of Boston College
- Current Assignee: Massachusetts Institute of Technology,Trustees of Boston College
- Current Assignee Address: US MA Cambridge US MA Chestnut Hill
- Agency: Nutter McClennen & Fish LLP
- Main IPC: B22F3/14
- IPC: B22F3/14 ; C22C1/04 ; H01L35/34 ; H01L35/14 ; B29C43/36 ; H01L35/16 ; H01L35/22

Abstract:
The present invention is generally directed to nanocomposite thermoelectric materials that exhibit enhanced thermoelectric properties. The nanocomposite materials include two or more components, with at least one of the components forming nano-sized structures within the composite material. The components are chosen such that thermal conductivity of the composite is decreased without substantially diminishing the composite's electrical conductivity. Suitable component materials exhibit similar electronic band structures. For example, a band-edge gap between at least one of a conduction band or a valence band of one component material and a corresponding band of the other component material at interfaces between the components can be less than about 5kBT, wherein kB is the Boltzman constant and T is an average temperature of said nanocomposite composition.
Public/Granted literature
- US20140191435A1 NANOCOMPOSITES WITH HIGH THERMOELECTRIC FIGURES OF MERIT Public/Granted day:2014-07-10
Information query