Invention Grant
- Patent Title: Acrylic pressure-sensitive adhesive compositions
- Patent Title (中): 丙烯酸类压敏粘合剂组合物
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Application No.: US12086614Application Date: 2006-12-14
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Publication No.: US09011995B2Publication Date: 2015-04-21
- Inventor: Seung-joon Park , In-cheon Han , Woo-ha Kim , Anna Lee , Suk-ky Chang
- Applicant: Seung-joon Park , In-cheon Han , Woo-ha Kim , Anna Lee , Suk-ky Chang
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge, LLP
- International Application: PCT/KR2006/005448 WO 20061214
- International Announcement: WO2007/069856 WO 20070621
- Main IPC: C08L33/02
- IPC: C08L33/02 ; C08L33/04 ; C08L35/02 ; C09K19/00 ; B32B7/12 ; C08L33/08 ; C08L33/14

Abstract:
The present invention relates to an acrylic pressure-sensitive adhesive composition, and more precisely, an acrylic pressure-sensitive adhesive composition which is prepared by copolymerization of a vinyl and/or acrylic monomer having a cross-linkable functional group and comprises 100 weight part of a high molecular weight (meth)acrylic copolymer which is prepared by copolymerization of a vinyl and/or acrylic monomer harboring a cross-linkable functional group and whose weight average molecular weight is 40˜100 times as high as the entanglement molecular weight, 5˜50 weight part of a low molecular weight (meth)acrylic copolymer which does not contain a cross-linkable functional group and whose weight average molecular weight is 2˜15 times as high as entanglement molecular weight, and 0.01˜10 weight part of a multifunctional cross-linking agent. The acrylic pressure-sensitive adhesive composition of the present invention has reliable adhesion durability under high temperature and high humidity and at the same time reduces the light leakage due to the stress relaxation and enhances the cutting-efficiency of a polarizing plate.
Public/Granted literature
- US20100129569A1 Acrylic Pressure-Sensitive Adhesive Compositions Public/Granted day:2010-05-27
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