发明授权
- 专利标题： Method of direct tiling of an image sensor array
- 专利标题（中）： 直接平铺图像传感器阵列的方法
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申请号： US14004660申请日： 2012-04-17
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公开(公告)号： US09012262B2公开(公告)日： 2015-04-21
- 发明人: Farrier Michael George , Roumbanis John Bernard
- 申请人： Farrier Michael George , Roumbanis John Bernard
- 申请人地址： US CA Thousand Oaks
- 专利权人： Teledyne Rad-icon Imaging Corp.
- 当前专利权人： Teledyne Rad-icon Imaging Corp.
- 当前专利权人地址： US CA Thousand Oaks
- 代理商 Eric A. Gifford
- 国际申请： PCT/US2012/000203 WO 20120417
- 国际公布： WO2012/145038 WO 20121026
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/495 ; H01L31/0232 ; H01L31/18 ; H01L23/00
摘要：
A method of making a tiled array of semiconductor dies includes aligning and flattening. One end of each semiconductor die has attached thereto a respective printed circuit board. The aligning aligns the semiconductor dies into the tiled array in such a way that the semiconductor dies rest on a vacuum plate and the one end of each die extends beyond an edge of the vacuum plate. The flattening flattens the semiconductor dies against the vacuum plate with a vacuum after the semiconductor dies are aligned.
公开/授权文献
- US20140035084A1 METHOD OF DIRECT TILING OF AN IMAGE SENSOR ARRAY 公开/授权日：2014-02-06