Invention Grant
- Patent Title: Circuit module and method of producing circuit module
- Patent Title (中): 电路模块及其制造方法
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Application No.: US14517424Application Date: 2014-10-17
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Publication No.: US09018039B2Publication Date: 2015-04-28
- Inventor: Eiji Mugiya , Takehiko Kai , Masaya Shimamura , Tetsuo Saji , Hiroshi Nakamura
- Applicant: Taiyo Yuden Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Fitch Even Tabin & Flannery LLP
- Priority: JP2013-165378 20130808
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L23/552 ; H01L21/56 ; H01L21/52
Abstract:
A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.
Public/Granted literature
- US20150044822A1 CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE Public/Granted day:2015-02-12
Information query
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