发明授权
US09018281B2 Set of resin compositions for preparing system-in-package type semiconductor device
有权
一套用于制备系统级封装型半导体器件的树脂组合物
- 专利标题： Set of resin compositions for preparing system-in-package type semiconductor device
- 专利标题（中）： 一套用于制备系统级封装型半导体器件的树脂组合物
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申请号： US13289619申请日： 2011-11-04
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公开(公告)号： US09018281B2公开(公告)日： 2015-04-28
- 发明人: Kazuaki Sumita , Kaoru Katoh , Taro Shimoda
- 申请人： Kazuaki Sumita , Kaoru Katoh , Taro Shimoda
- 申请人地址： JP Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP2006-249802 20060914; JP2007-232555 20070907
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; C08L63/00 ; C09D163/00 ; H01L23/31 ; H01L21/56 ; H01L23/29 ; H01L25/065 ; H01L23/00
摘要：
Set of compositions for preparing system-in-package type semiconductor device. The composition set consists of underfill composition for preparing underfill part and encapsulation resin composition for preparing resin encapsulation part. 1) A cured product of the underfill composition has a glass transition temperature, Tg, ≧100° C. and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by ≦20° C. 2) Total linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg−30)° C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg−30)° C. is ≦42 ppm/° C. 3) A ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0.
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