Invention Grant
- Patent Title: Wired circuit board including an insulating layer formed with an opening filled with a conductive portion and producing method thereof
- Patent Title (中): 有线电路板，包括形成有填充有导电部分的开口的绝缘层及其制造方法
-
Application No.: US13889839Application Date: 2013-05-08
-
Publication No.: US09018540B2Publication Date: 2015-04-28
- Inventor: Jun Ishii , Saori Kanezaki
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2012-121550 20120529
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02 ; H05K3/42 ; H05K1/05 ; H05K3/32
Abstract:
A wired circuit board includes an insulating layer to be formed with an opening extending therethrough in a thickness direction of the wired circuit board, a conductive layer formed on one surface of the insulating layer in the thickness direction and including a one-side terminal portion, an other-side terminal portion formed on the other surface of the insulating layer in the thickness direction, disposed so as to overlap the opening and the one-side terminal portion when projected in the thickness direction, and used to be connected to an electronic element via a conductive adhesive, and a conductive portion filling the opening to provide electrical conduction between the one-side terminal portion and the other-side terminal portion.
Public/Granted literature
- US20130319748A1 WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF Public/Granted day:2013-12-05
Information query
