Invention Grant
- Patent Title: Bus system including a master device, a slave device, an interconnector coupled between the master device and the slave device, and an operating method thereof
- Patent Title (中): 总线系统，包括主设备，从设备，耦合在主设备和从设备之间的互连器及其操作方法
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Application No.: US14170086Application Date: 2014-01-31
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Publication No.: US09021171B2Publication Date: 2015-04-28
- Inventor: Bub-chul Jeong , Jaegeun Yun
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Main IPC: G06F13/00
- IPC: G06F13/00 ; G06F13/364 ; G06F13/362 ; G06F13/14
Abstract:
A system-on-chip bus system and an operating method of the same are provided. The bus system includes a master device, a slave device and an interconnector coupled between the master device and the slave device. The interconnector includes a synchronization/compaction block to control traffic provided from a master device to a slave device. When a write request traffic and a corresponding write data traffic are all provided from the master device, the synchronization/compaction block may transfer the two traffics to the slave device.
Public/Granted literature
- US20140149619A1 BUS SYSTEM INCLUDING AN INTERCONNECTOR, A MASTER DEVICE, A SLAVE DEVICE, AND AN OPERATING METHOD THEREOF Public/Granted day:2014-05-29
Information query
