发明授权
US09022603B1 Systems, methods, and devices for sealing LED light sources in a light module 有权
用于在光模块中密封LED光源的系统,方法和装置

Systems, methods, and devices for sealing LED light sources in a light module
摘要:
A light module includes circuit board with a top and bottom side. Multiple light emitting diodes (LEDs) are positioned along the top side of the circuit board. A bottom side of a gas permeable layer of material having top and bottom sides is adhered to at least a portion of the top side of the circuit board. A pair of elongated double-sided adhesive strips are coupled to the top side of the gas-permeable material near opposing ends of the circuit board. An optical lenses is positioned over each of the LEDs. A cover panel is then positioned over the circuit board, the first layer of material, the adhesive strips and at least a portion of each optic and adhered to top side of each of the elongated adhesive strips. Each lens includes an optical cavity and a recessed area adjacent the optical cavity for receiving a reflector therein.
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