发明授权
US09022603B1 Systems, methods, and devices for sealing LED light sources in a light module
有权
用于在光模块中密封LED光源的系统,方法和装置
- 专利标题: Systems, methods, and devices for sealing LED light sources in a light module
- 专利标题(中): 用于在光模块中密封LED光源的系统,方法和装置
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申请号: US13462326申请日: 2012-05-02
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公开(公告)号: US09022603B1公开(公告)日: 2015-05-05
- 发明人: Khurram Zeshan Moghal , Hung T. Dinh
- 申请人: Khurram Zeshan Moghal , Hung T. Dinh
- 申请人地址: US TX Houston
- 专利权人: Cooper Technologies Company
- 当前专利权人: Cooper Technologies Company
- 当前专利权人地址: US TX Houston
- 代理机构: King & Spalding LLP
- 主分类号: F21V21/00
- IPC分类号: F21V21/00 ; F21V17/10
摘要:
A light module includes circuit board with a top and bottom side. Multiple light emitting diodes (LEDs) are positioned along the top side of the circuit board. A bottom side of a gas permeable layer of material having top and bottom sides is adhered to at least a portion of the top side of the circuit board. A pair of elongated double-sided adhesive strips are coupled to the top side of the gas-permeable material near opposing ends of the circuit board. An optical lenses is positioned over each of the LEDs. A cover panel is then positioned over the circuit board, the first layer of material, the adhesive strips and at least a portion of each optic and adhered to top side of each of the elongated adhesive strips. Each lens includes an optical cavity and a recessed area adjacent the optical cavity for receiving a reflector therein.
公开/授权文献
- US1697985A Signal tab 公开/授权日:1929-01-08
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