Invention Grant
- Patent Title: Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
- Patent Title (中): 润湿波前控制，减少晶片进入电镀槽期间的空气滞留
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Application No.: US13460423Application Date: 2012-04-30
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Publication No.: US09028666B2Publication Date: 2015-05-12
- Inventor: Manish Ranjan , Shantinath Ghongadi , Frederick Dean Wilmot , Douglas Hill , Bryan L. Buckalew
- Applicant: Manish Ranjan , Shantinath Ghongadi , Frederick Dean Wilmot , Douglas Hill , Bryan L. Buckalew
- Applicant Address: US CA Fremont
- Assignee: Novellus Systems, Inc.
- Current Assignee: Novellus Systems, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: C25D5/00
- IPC: C25D5/00 ; C25D17/00 ; C25D7/12 ; H01L21/288
Abstract:
Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.
Public/Granted literature
- US20120292192A1 WETTING WAVE FRONT CONTROL FOR REDUCED AIR ENTRAPMENT DURING WAFER ENTRY INTO ELECTROPLATING BATH Public/Granted day:2012-11-22
Information query
