发明授权
- 专利标题： Thermosetting resin composition, B-stage heat conductive sheet, and power module
- 专利标题（中）： 热固性树脂组合物，B级导热片和电源模块
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申请号： US13576065申请日： 2010-12-28
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公开(公告)号： US09029438B2公开(公告)日： 2015-05-12
- 发明人: Kei Yamamoto , Takashi Nishimura , Kenji Mimura , Motoki Masaki , Seiki Hiramatsu , Xiaohong Yin
- 申请人： Kei Yamamoto , Takashi Nishimura , Kenji Mimura , Motoki Masaki , Seiki Hiramatsu , Xiaohong Yin
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Electric Corporation
- 当前专利权人： Mitsubishi Electric Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2010-037501 20100223
- 国际申请： PCT/JP2010/073776 WO 20101228
- 国际公布： WO2011/104996 WO 20110901
- 主分类号： C08G59/40
- IPC分类号： C08G59/40 ; C08K3/10 ; H01L23/373 ; H01L25/07 ; H01L23/495 ; H01L23/00
摘要：
Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 μm to 80 μm. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.
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