发明授权
- 专利标题： Chip package and method for forming the same
- 专利标题（中）： 芯片封装及其形成方法
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申请号： US13467887申请日： 2012-05-09
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公开(公告)号： US09035456B2公开(公告)日： 2015-05-19
- 发明人: Chien-Hung Liu
- 申请人： Chien-Hung Liu
- 代理机构： Liu & Liu
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/00 ; H01L25/065 ; H01L21/78 ; H01L23/31 ; H01L21/56
摘要：
An embodiment of the invention provides a chip package which includes: a first substrate; a second substrate disposed on the first substrate, wherein the second substrate has at least one opening penetrating through the second substrate, and the at least one opening defines a plurality of conducting regions electrically insulated from each other in the second substrate; a first insulating layer disposed on a side of the first substrate and filling in the at least one opening of the second substrate; a carrier substrate disposed on the second substrate; a second insulating layer disposed on a surface and a sidewall of the carrier substrate; and a conducting layer disposed on the second insulating layer on the carrier substrate and electrically contacting with one of the conducting regions.
公开/授权文献
- US20120286421A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME 公开/授权日：2012-11-15
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