Invention Grant
US09041226B2 Chip arrangement and a method of manufacturing a chip arrangement 有权
芯片布置和芯片布置方法

Chip arrangement and a method of manufacturing a chip arrangement
Abstract:
In various embodiments, a chip arrangement is provided. The chip arrangement may include a chip carrier and a chip mounted on the chip carrier. The chip may include at least two chip contacts and an insulating adhesive between the chip and the chip carrier to adhere the chip to the chip carrier. The at least two chip contacts may be electrically coupled to the chip carrier.
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