发明授权
US09048026B2 Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor mounted thereon, and packing unit for multilayered ceramic capacitor
有权
多层陶瓷电容器，其上安装有多层陶瓷电容器的电路板的安装结构，以及用于多层陶瓷电容器的封装单元
- 专利标题： Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor mounted thereon, and packing unit for multilayered ceramic capacitor
- 专利标题（中）： 多层陶瓷电容器，其上安装有多层陶瓷电容器的电路板的安装结构，以及用于多层陶瓷电容器的封装单元
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申请号： US13764184申请日： 2013-02-11
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公开(公告)号： US09048026B2公开(公告)日： 2015-06-02
- 发明人: Young Ghyu Ahn , Min Cheol Park , Tae Hyeok Kim , Sang Soo Park
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址： KR Suwon, Gyunggi-Do
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon, Gyunggi-Do
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2012-0126450 20121109
- 主分类号： H01G4/30
- IPC分类号： H01G4/30 ; H01G4/06 ; H01G4/12 ; H05K3/34 ; H01G2/06 ; H01G4/012
摘要：
There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer, the lower cover layer being thicker than the upper cover layer; a dummy electrode formed inside at least one of the upper and lower cover layers; and first and second external electrodes, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745.
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