发明授权
- 专利标题： Substrate conveying container opening/closing device, lid opening/closing device and semiconductor manufacturing apparatus
- 专利标题（中）： 基板输送容器开闭装置，盖开闭装置及半导体制造装置
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申请号： US13488713申请日： 2012-06-05
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公开(公告)号： US09048273B2公开(公告)日： 2015-06-02
- 发明人: Katsuhiko Oyama , Katsuyuki Hishiya , Yasushi Takeuchi
- 申请人： Katsuhiko Oyama , Katsuyuki Hishiya , Yasushi Takeuchi
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 代理机构： Nath, Goldberg & Meyer
- 代理商 Jerald L. Meyer
- 优先权： JP2011-127539 20110607
- 主分类号： H01L21/677
- IPC分类号： H01L21/677
摘要：
A substrate conveying container opening/closing device includes an elevator carriage provided in a substrate transfer area and configured to be moved up and down by an elevator mechanism, a cover member for opening and closing an opening of a wall, a seal member for sealing a gap between the cover member and the periphery of the opening, a lid detaching/attaching mechanism provided in the cover member and configured to detach and attach the lid, a guide unit provided in the elevator carriage and configured to guide the cover member upward so that the cover member can advance from a retracting position toward the wall, a guideway provided in the wall to extend in a direction perpendicular to a seal surface of the opening, and a rotating body provided in the cover member and configured to roll downward along the guideway as the elevator carriage is moved downward.
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