Disclosed herein are various chip packaging structures and arrangements. In one embodiment, a multiple-component chip packaging structure can include: (i) a first component arranged on a bottom layer; (ii) at least one second component arranged on the first component, where the at least one the second component is electrically connected to the first component by a plurality of protruding structures; (iii) at least one third component on the at least one second component; (iv) at least one extension structure arranged on at least one side of the at least one third component, where the at least one extension structure is configured to lead out electric polarities of the at least one third component; and (v) a plurality of bonding wires that electrically connect the at least one extension structure to the first component.