发明授权
- 专利标题： Integrated circuit assembly for high-frequency on-board printed circuit board testing,validation, and verification
- 专利标题（中）： 用于高频板载印刷电路板测试，验证和验证的集成电路组件
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申请号： US13586981申请日： 2012-08-16
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公开(公告)号： US09054466B2公开(公告)日： 2015-06-09
- 发明人: David S. Lin
- 申请人： David S. Lin
- 申请人地址： TW Taipei
- 专利权人： UNIGEN TAIWAN CORPORATION
- 当前专利权人： UNIGEN TAIWAN CORPORATION
- 当前专利权人地址： TW Taipei
- 代理机构： Ladas & Parry LLP
- 主分类号： H05K7/00
- IPC分类号： H05K7/00 ; H01R12/71 ; H01R12/73 ; H05K1/14 ; H05K3/32 ; H05K3/34
摘要：
An integrated circuit assembly includes a main board unit mounted fixedly on and connected electrically to an external circuit board, a daughter board unit disposed on and connected detachably to the main board unit, and an integrated circuit device mounted fixedly on and connected electrically to the daughter board unit. When the daughter board unit is connected to the main board unit, the integrated circuit device is connected electrically to the external circuit board via the main board unit and the daughter board unit.
公开/授权文献
- US20140049896A1 INTEGRATED CIRCUIT ASSEMBLY 公开/授权日：2014-02-20
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