发明授权
US09059202B2 Metal-oxide-semiconductor (MOS) device and method for fabricating the same
有权
金属氧化物半导体(MOS)器件及其制造方法
- 专利标题: Metal-oxide-semiconductor (MOS) device and method for fabricating the same
- 专利标题(中): 金属氧化物半导体(MOS)器件及其制造方法
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申请号: US13807315申请日: 2011-11-30
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公开(公告)号: US09059202B2公开(公告)日: 2015-06-16
- 发明人: Yan Jin
- 申请人: Yan Jin
- 申请人地址: CN Wuxi CN Wuxi
- 专利权人: CSMC TECHNOLOGIES FAB1 CO., LTD.,CSMC TECHNOLOGIES FAB2 CO., LTD.
- 当前专利权人: CSMC TECHNOLOGIES FAB1 CO., LTD.,CSMC TECHNOLOGIES FAB2 CO., LTD.
- 当前专利权人地址: CN Wuxi CN Wuxi
- 代理机构: Anova Law Group, PLLC
- 优先权: CN201010603672 20101224
- 国际申请: PCT/CN2011/083231 WO 20111130
- 国际公布: WO2012/083787 WO 20120628
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; H01L29/66 ; H01L29/423 ; H01L29/78
摘要:
A Metal-Oxide-Semiconductor (MOS) device is disclosed. The MOS device includes a substrate, a well region formed in the substrate, and a gate located on the substrate. The MOS device also includes a first lightly-doped region arranged in the well region at a first side of the gate and overlapping with the gate, and a second lightly-doped region arranged in the well region at a second side of the gate and overlapping with the gate. Further, the MOS device includes a first heavily-doped region formed in the first lightly-doped region, and a second heavily-doped region formed in the second lightly-doped region. The MOS device also includes a first high-low-voltage gate oxide boundary arranged between the first heavily-doped region and the gate, and a second high-low-voltage gate oxide boundary arranged between the second heavily-doped region and the gate. The gate covers the first high-low-voltage gate oxide boundary and the second high-low-voltage gate oxide boundary at the first side and the second side of the gate, respectively.
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