Invention Grant
- Patent Title: Wire drawing die
- Patent Title (中): 拉丝模具
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Application No.: US12523545Application Date: 2008-01-18
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Publication No.: US09061336B2Publication Date: 2015-06-23
- Inventor: Hitoshi Sumiya , Makoto Yukawa
- Applicant: Hitoshi Sumiya , Makoto Yukawa
- Applicant Address: JP Osaka-shi JP Tokyo JP Itami-shi
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.,A.L.M.T. CORP.,SUMITOMO ELECTRIC HARDMETAL CORP.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.,A.L.M.T. CORP.,SUMITOMO ELECTRIC HARDMETAL CORP.
- Current Assignee Address: JP Osaka-shi JP Tokyo JP Itami-shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2007-010101 20070119
- International Application: PCT/JP2008/050621 WO 20080118
- International Announcement: WO2008/088048 WO 20080724
- Main IPC: B21C3/02
- IPC: B21C3/02 ; B21C3/18 ; C30B29/60 ; B01J3/06 ; B82Y30/00 ; C04B35/52 ; C04B35/645

Abstract:
One object of the present invention is to provide a wire drawing die excellent in strength and wear resistance. The wire drawing die has a core formed using highly hard diamond polycrystalline body made substantially only of diamond and produced by directly converting a raw material composition including a non-diamond type carbon material into diamond and sintering the diamond at an ultra high pressure and an ultra high temperature without adding a sintering aid or a catalyst, the polycrystalline body having a mixed construction including fine-grained diamond crystals with a maximum grain size of less than or equal to 100 nm and an average grain size of less than or equal to 50 nm and plate-like or particulate coarse-grained diamond crystals with a minimum grain size of greater than or equal to 50 nm and a maximum grain size of less than or equal to 10000 nm.
Public/Granted literature
- US20100043520A1 WIRE DRAWING DIE Public/Granted day:2010-02-25
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