Invention Grant
- Patent Title: Sensor element and carrier element for manufacturing a sensor
- Patent Title (中): 用于制造传感器的传感器元件和载体元件
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Application No.: US13121542Application Date: 2009-10-01
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Publication No.: US09061454B2Publication Date: 2015-06-23
- Inventor: Edmond De Volder , Dietmar Huber , Andreas Doering , Jakob Schillinger , Martin Watzlawik , Lothar Biebricher
- Applicant: Edmond De Volder , Dietmar Huber , Andreas Doering , Jakob Schillinger , Martin Watzlawik , Lothar Biebricher
- Applicant Address: DE
- Assignee: Continental Teves AG & Co. oHG
- Current Assignee: Continental Teves AG & Co. oHG
- Current Assignee Address: DE
- Agency: RatnerPrestia
- Priority: DE102008049958 20081002; DE102008064047 20081219
- International Application: PCT/EP2009/062752 WO 20091001
- International Announcement: WO2010/037812 WO 20100408
- Main IPC: G01D11/30
- IPC: G01D11/30 ; B29C45/14 ; B29C33/12 ; B29C45/16 ; G01D11/24 ; G01P1/02
Abstract:
A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.
Public/Granted literature
- US20110179889A1 SENSOR ELEMENT AND CARRIER ELEMENT FOR MANUFACTURING A SENSOR Public/Granted day:2011-07-28
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