利索-全球专利检索

  1. 登录
  2. 注册
发明授权
US09061888B2 Sensor module and method for producing sensor modules 有权
传感器模块和传感器模块的制造方法

Sensor module and method for producing sensor modules
摘要：
Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout.
摘要（中）：

传感器模块，包括载体，至少一个传感器芯片和至少一个电耦合到传感器芯片的评估芯片。 载体具有切口，传感器芯片至少部分地位于该切口中。 评估芯片布置在载体上并且至少部分地覆盖切口。

公开/授权文献
信息查询
Espacenet
0/0