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公开(公告)号：US09061888B2
公开(公告)日：2015-06-23
申请号：US13190732
申请日：2011-07-26
申请人： Wolfgang Pahl , Gregor Feiertag , Anton Leidl
发明人： Wolfgang Pahl , Gregor Feiertag , Anton Leidl
CPC分类号： B81B7/0048 , B81B2207/092 , B81B2207/096 , B81C1/0023 , B81C2203/0136 , H01L2224/0554 , H01L2224/05554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32145 , H01L2224/48471 , H01L2224/73265 , H01L2924/00014 , H01L2924/1461 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout.
摘要翻译： 传感器模块，包括载体，至少一个传感器芯片和至少一个电耦合到传感器芯片的评估芯片。 载体具有切口，传感器芯片至少部分地位于该切口中。 评估芯片布置在载体上并且至少部分地覆盖切口。
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公开(公告)号：US20130140656A1
公开(公告)日：2013-06-06
申请号：US13805630
申请日：2011-07-07
申请人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
发明人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2207/096 , B81C1/00309 , H01L2224/16225 , H01L2924/15151 , H01L2924/16151 , H04R1/086 , H04R1/38 , H04R19/005 , H04R19/04 , H04R29/004 , H04R31/006
摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (SO1) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (SO1) is closed; and a second sound inlet opening (SO2) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (SO1) is prepared but closed.
摘要翻译： 本发明涉及一种用于制造麦克风的方法，其中传感器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（SO1）; 进行麦克风的功能测试; 第一声音入口开口（SO1）关闭; 并且在盖中产生第二声音入口开口（SO2）。 本发明还涉及一种由该方法产生的麦克风，其中第一声音入口开口（SO1）准备但关闭。
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公开(公告)号：US08865499B2
公开(公告)日：2014-10-21
申请号：US13805630
申请日：2011-07-07
申请人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
发明人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
IPC分类号： H01L21/00
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2207/096 , B81C1/00309 , H01L2224/16225 , H01L2924/15151 , H01L2924/16151 , H04R1/086 , H04R1/38 , H04R19/005 , H04R19/04 , H04R29/004 , H04R31/006
摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S01) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S01) is closed; and a second sound inlet opening (S02) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S01) is prepared but closed.
摘要翻译： 本发明涉及一种用于制造麦克风的方法，其中换能器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（S01）; 进行麦克风的功能测试; 第一声音入口（S01）关闭; 并且在盖中产生第二声音入口（S02）。 本发明还涉及由该方法产生的麦克风，其中第一声音入口开口（S01）准备但关闭。
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公开(公告)号：US20110298064A1
公开(公告)日：2011-12-08
申请号：US13190732
申请日：2011-07-26
申请人： Wolfgang Pahl , Gregor Feiertag , Anton Leidl
发明人： Wolfgang Pahl , Gregor Feiertag , Anton Leidl
CPC分类号： B81B7/0048 , B81B2207/092 , B81B2207/096 , B81C1/0023 , B81C2203/0136 , H01L2224/0554 , H01L2224/05554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32145 , H01L2224/48471 , H01L2224/73265 , H01L2924/00014 , H01L2924/1461 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout.
摘要翻译： 传感器模块，包括载体，至少一个传感器芯片和至少一个电耦合到传感器芯片的评估芯片。 载体具有切口，传感器芯片至少部分地位于该切口中。 评估芯片布置在载体上并且至少部分地覆盖切口。
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5.发明申请MEMS Component, Method for Producing a MEMS Component, and Method for Handling a MEMS Component 有权MEMS部件，用于制造MEMS部件的方法以及处理MEMS部件的方法公开(公告)号：US20110018076A1
公开(公告)日：2011-01-27
申请号：US12842677
申请日：2010-07-23
申请人： Wolfgang Pahl , Gregor Feiertag , Anton Leidl
发明人： Wolfgang Pahl , Gregor Feiertag , Anton Leidl
CPC分类号： B81C1/00896 , B81B7/0061 , B81B2201/0257 , B81C2201/053 , H04R2201/003
摘要： A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side.
摘要翻译： MEMS部件包括其中存在至少一个空腔的基板。 空腔朝向基板的活动侧封闭。 非活性侧被布置成与衬底的有源侧相对，并且衬底在不活动侧被覆盖膜覆盖。
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6.发明授权MEMS component, method for producing a MEMS component, and method for handling a MEMS component 有权MEMS部件，用于制造MEMS部件的方法以及用于处理MEMS部件的方法公开(公告)号：US08674464B2
公开(公告)日：2014-03-18
申请号：US12842677
申请日：2010-07-23
申请人： Wolfgang Pahl , Gregor Feiertag , Anton Leidl
发明人： Wolfgang Pahl , Gregor Feiertag , Anton Leidl
CPC分类号： B81C1/00896 , B81B7/0061 , B81B2201/0257 , B81C2201/053 , H04R2201/003
摘要： A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side.
摘要翻译： MEMS部件包括其中存在至少一个空腔的基板。 空腔朝向基板的活动侧封闭。 非活性侧被布置成与衬底的有源侧相对，并且衬底在不活动侧被覆盖膜覆盖。
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7.发明申请Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method 有权包含MEMS和ASIC的微型电气元件和生产方法公开(公告)号：US20130119492A1
公开(公告)日：2013-05-16
申请号：US13520923
申请日：2011-01-24
申请人： Gregor Feiertag , Hans Krueger , Wolfgang Pahl , Anton Leidl
发明人： Gregor Feiertag , Hans Krueger , Wolfgang Pahl , Anton Leidl
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81C1/00238 , B81C1/00309 , G01L9/0073 , H01L23/10 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L2224/131 , H01L2224/1329 , H01L2224/133 , H01L2224/16145 , H01L2224/16146 , H01L2224/27438 , H01L2224/29011 , H01L2224/29013 , H01L2224/291 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/73203 , H01L2224/81801 , H01L2224/8185 , H01L2224/83825 , H01L2224/8385 , H01L2224/83851 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2924/01029 , H01L2924/07811 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/163 , H01L2924/181 , H04R19/04 , H01L2224/81 , H01L2224/83 , H01L2924/014 , H01L2924/00
摘要： The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.
摘要翻译： 本发明涉及包括MEMS芯片和ASIC芯片的小型化电气部件。 MEMS芯片和ASIC芯片设置在彼此的顶部; MEMS芯片和ASIC芯片的内部安装通过MEMS芯片或ASIC芯片的通孔连接到电气部件的外部电气端子。
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公开(公告)号：US20120093346A1
公开(公告)日：2012-04-19
申请号：US13282668
申请日：2011-10-27
IPC分类号： H04R1/00
CPC分类号： H04R19/005 , H01L24/97 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H01L2924/1461 , H04R1/2884 , H01L2924/00 , H01L2224/0401
摘要： A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the −3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package.
摘要翻译： 一种麦克风包，其中MEMS麦克风芯片（MIC）安装在基板（SUB）上并且相对于基板用盖（ABD）密封。 麦克风芯片的膜（MMB）通过声道连接到基板中的声音入口（SEO）。 由于声音入口开口和通道的横截面和长度的限定尺寸的确定，形成声学低通滤波器，其-3dB衰减点明显低于麦克风膜的天然共振， 包。
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9.发明授权Miniaturized electrical component comprising an MEMS and an ASIC and production method 有权微型电气元件包括MEMS和ASIC及其制造方法公开(公告)号：US09056760B2
公开(公告)日：2015-06-16
申请号：US13520923
申请日：2011-01-24
申请人： Gregor Feiertag , Hans Krueger , Wolfgang Pahl , Anton Leidl
发明人： Gregor Feiertag , Hans Krueger , Wolfgang Pahl , Anton Leidl
IPC分类号： H01L29/72 , B81B7/00 , B81C1/00 , G01L9/00 , H01L23/10 , H04R19/04 , H01L23/552 , H01L23/00 , H01L25/065
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81C1/00238 , B81C1/00309 , G01L9/0073 , H01L23/10 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L2224/131 , H01L2224/1329 , H01L2224/133 , H01L2224/16145 , H01L2224/16146 , H01L2224/27438 , H01L2224/29011 , H01L2224/29013 , H01L2224/291 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/73203 , H01L2224/81801 , H01L2224/8185 , H01L2224/83825 , H01L2224/8385 , H01L2224/83851 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2924/01029 , H01L2924/07811 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/163 , H01L2924/181 , H04R19/04 , H01L2224/81 , H01L2224/83 , H01L2924/014 , H01L2924/00
摘要： The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.
摘要翻译： 本发明涉及包括MEMS芯片和ASIC芯片的小型化电气部件。 MEMS芯片和ASIC芯片设置在彼此的顶部; MEMS芯片和ASIC芯片的内部安装通过MEMS芯片或ASIC芯片的通孔连接到电气部件的外部电气端子。
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公开(公告)号：US08571239B2
公开(公告)日：2013-10-29
申请号：US13282668
申请日：2011-10-27
CPC分类号： H04R19/005 , H01L24/97 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H01L2924/1461 , H04R1/2884 , H01L2924/00 , H01L2224/0401
摘要： A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the −3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package.
摘要翻译： 一种麦克风包，其中MEMS麦克风芯片（MIC）安装在基板（SUB）上并且相对于基板用盖（ABD）密封。 麦克风芯片的膜（MMB）通过声道连接到基板中的声音输入开口（SEO）。 由于声音入口开口和通道的横截面和长度的限定尺寸的确定，形成声学低通滤波器，其-3dB衰减点明显低于麦克风膜的天然共振， 包。
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