发明授权
- 专利标题： Package member for electronic component and optical device including the package member
- 专利标题（中）： 包括包装件的电子部件和光学装置的包装件
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申请号： US13602645申请日： 2012-09-04
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公开(公告)号： US09063004B2公开(公告)日： 2015-06-23
- 发明人: Toshishige Fujii , Satoru Sugawara
- 申请人： Toshishige Fujii , Satoru Sugawara
- 申请人地址： JP Tokyo
- 专利权人： RICOH COMPANY, LTD.
- 当前专利权人： RICOH COMPANY, LTD.
- 当前专利权人地址： JP Tokyo
- 代理机构： Cooper & Dunham LLP
- 优先权： JP2011-195668 20110908; JP2012-129574 20120607
- 主分类号： H01J5/02
- IPC分类号： H01J5/02 ; G01J1/04 ; H01S5/022 ; H01S5/0683 ; H01S5/42
摘要：
A ceramic package includes a chip mounting portion, a photodiode (PD) mounting portion, a plurality of connecting terminals, and a gold-plated portion. The chip mounting portion is a portion on which a surface-emitting laser array chip is mounted on a first ceramic layer. The PD mounting portion is provided to a second ceramic layer stacked on the positive side in a c-axis direction of the first ceramic layer. Openings are formed at four corners of the PD mounting portion. A scale is formed on a portion that can be observed through the opening of the second ceramic layer on the surface of the positive side in the c-axis direction of the first ceramic layer.
公开/授权文献
- US20130062510A1 PACKAGE MEMBER AND OPTICAL DEVICE 公开/授权日：2013-03-14
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