Invention Grant
- Patent Title: Vibration transducer and its manufacturing method
- Patent Title (中): 振动传感器及其制造方法
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Application No.: US13228855Application Date: 2011-09-09
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Publication No.: US09063023B2Publication Date: 2015-06-23
- Inventor: Takashi Yoshida
- Applicant: Takashi Yoshida
- Applicant Address: JP Tokyo
- Assignee: YOKOGAWA ELECTRIC CORPORATION
- Current Assignee: YOKOGAWA ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-203032 20100910
- Main IPC: G01L9/08
- IPC: G01L9/08 ; G01H13/00 ; G01L9/00 ; G01L1/10 ; B81B3/00

Abstract:
A vibration transducer includes a silicon single crystal vibration beam provided over a silicon single crystal substrate, the vibration beam having a sectional shape that is longer in a direction perpendicular to a surface of the silicon single crystal substrate than in a direction parallel with it, a shell made of silicon, surrounding the vibration beam with a gap, and forming a vacuum room together with the silicon single crystal substrate, a plate-like first electrode plate disposed parallel with the surface of the silicon single crystal substrate, the first electrode plate having one end connected to the vibration beam, plate-like second and third electrode plates disposed parallel with the surface of the silicon single crystal substrate so as to be opposed to each other with the vibration beam interposed in between, and asperities formed on confronting side surfaces of the vibration beam and the second and third electrode plates.
Public/Granted literature
- US20120060607A1 VIBRATION TRANSDUCER AND ITS MANUFACTURING METHOD Public/Granted day:2012-03-15
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