Invention Grant
- Patent Title: Rotating apparatus capable of improving the shock resistance and method for manufacturing the rotating apparatus
- Patent Title (中): 能够改善耐冲击性的旋转装置和旋转装置的制造方法
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Application No.: US14557826Application Date: 2014-12-02
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Publication No.: US09064531B2Publication Date: 2015-06-23
- Inventor: Mitsuo Kodama , Ryusuke Sugiki , Akira Aoi
- Applicant: Samsung Electro-Mechanics Japan Advanced Technology Co., Ltd.
- Applicant Address: JP Shizuoka
- Assignee: SAMSUNG ELECTRO-MECHANICS JAPAN ADVANCED TECHNOLOGY, CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS JAPAN ADVANCED TECHNOLOGY, CO., LTD.
- Current Assignee Address: JP Shizuoka
- Agency: Z IP Law PLLC
- Priority: JP2010-234705 20101019
- Main IPC: G11B19/20
- IPC: G11B19/20 ; F16C33/74 ; H02K5/16

Abstract:
A rotating apparatus includes a hub, a shaft housing portion having a center through-hole, a base plate, and a shaft with a cylindrical section housed in the through-hole. At a joint between the shaft housing portion and the hub is formed a bonding region for bonding the shaft housing portion and the hub by a hardening resin, and a narrow-gap region more toward the base plate than the bonding region. A gap between the shaft housing portion and the hub in the narrow-gap region is narrower than a gap between the shaft housing portion and the hub in the bonding region. The hub includes a fourth circumferential recessed portion recessed in the axial direction and a lower circumferential raised portion projecting in the axial direction on a radially inner side of the fourth circumferential recessed portion. The narrow-gap region is located inside the lower circumferential raised portion.
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