Invention Grant
- Patent Title: Heated cooling plate for E-chucks and pedestals
- Patent Title (中): 用于E型卡盘和基座的加热冷却板
-
Application No.: US12603149Application Date: 2009-10-21
-
Publication No.: US09064911B2Publication Date: 2015-06-23
- Inventor: Shambhu N. Roy , Matt Cheng-hsiung Tsai
- Applicant: Shambhu N. Roy , Matt Cheng-hsiung Tsai
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67
Abstract:
A method and apparatus for controlling the temperature of a substrate support assembly includes a pedestal, a chuck connected to the pedestal, a cooling plate structure thermally coupled with the chuck, a heater thermally coupled with the cooling plate structure, and a controller configured to control the cooling plate structure while controlling the heater during processing of a substrate on the chuck. The method includes cooling a substrate support with a cooling plate structure while heating the cooling plate structure with a heater thermally coupled with the cooling plate structure, monitoring the performance of the cooling plate structure and the heater, and regulating the performance of the cooling plate structure and the heater to maintain the substrate support at a desired temperature.
Public/Granted literature
- US20100101771A1 HEATED COOLING PLATE FOR E-CHUCKS AND PEDESTALS Public/Granted day:2010-04-29
Information query
IPC分类:
