发明授权
- 专利标题： Circuit board having bypass pad
- 专利标题（中）： 电路板，旁路板
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申请号： US14104315申请日： 2013-12-12
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公开(公告)号： US09069036B2公开(公告)日： 2015-06-30
- 发明人: Sang-Guk Han , Seok-Joon Moon , Beom-jun Jin
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- 代理机构： Muir Patent Law, PLLC
- 优先权： KR10-2007-0129057 20071212
- 主分类号： G01R31/00
- IPC分类号： G01R31/00 ; G01R31/28 ; H01L23/538 ; H05K1/02 ; H01L21/66 ; H01L25/065 ; H01L25/18 ; H05K1/11 ; H05K3/28 ; H05K3/32 ; H01L23/00
摘要：
An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.
公开/授权文献
- US20140097865A1 CIRCUIT BOARD HAVING BYPASS PAD 公开/授权日：2014-04-10
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