Invention Grant
- Patent Title: Smart card module and method for producing a smart card module
- Patent Title (中): 智能卡模块及智能卡模块的制造方法
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Application No.: US14292270Application Date: 2014-05-30
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Publication No.: US09070067B2Publication Date: 2015-06-30
- Inventor: Juergen Hoegerl , Andreas Mueller-Hipper , Frank Pueschner , Wolfgang Schindler , Peter Stampka
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102013105729 20130604
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G06K19/077 ; H01L23/00
Abstract:
A smart card module for use in a smart card includes a microchip and a contact zone for making contact with the microchip by means of a reader. The microchip can be enclosed by an encapsulation which can enclose the microchip completely from all sides.
Public/Granted literature
- US20140353387A1 Smart Card Module and Method for Producing a Smart Card Module Public/Granted day:2014-12-04
Information query
