Invention Grant
- Patent Title: Measuring probe for non-destructive measuring of the thickness of thin layers
- Patent Title (中): 测量探头用于非破坏性测量薄层厚度
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Application No.: US13066797Application Date: 2011-04-25
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Publication No.: US09074880B2Publication Date: 2015-07-07
- Inventor: Helmut Fischer
- Applicant: Helmut Fischer
- Applicant Address: DE Sindelfingen
- Assignee: HELMUT FISCHER GMBH INSTITUT FUER ELEKTRONIK UND MESSTECHNIK
- Current Assignee: HELMUT FISCHER GMBH INSTITUT FUER ELEKTRONIK UND MESSTECHNIK
- Current Assignee Address: DE Sindelfingen
- Agency: Kriegsman & Kriegsman
- Priority: DE202010006061U 20100423
- Main IPC: G01B7/06
- IPC: G01B7/06 ; G01B21/08

Abstract:
The invention relates to a measuring probe for non-destructive measuring of the thickness of thin layers, in particular in cavities, which are accessible by an opening or on curved surfaces, with a measuring head, which comprises at least one sensor element and at least one contact spherical cap, assigned to the sensor element on a surface, to be checked, of the cavity, and with a gripping element for positioning and guiding the measuring probe on and/or along the surface to be measured, wherein on the gripping element, a long, elastically yielding guide bar is provided, which accepts the at least one measuring head on its end opposing the gripping element, in such a way that it is moveable with at least one degree of freedom in relation to the guide bar.
Public/Granted literature
- US20110260721A1 Measuring probe for non-destructive measuring of the thickness of thin layers Public/Granted day:2011-10-27
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