发明授权
- 专利标题: Laminated ceramic electronic component having a cover layer with dielectric grains and method of fabricating the same
- 专利标题(中): 具有电介质晶粒的覆盖层的层叠陶瓷电子部件及其制造方法
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申请号: US13839781申请日: 2013-03-15
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公开(公告)号: US09076596B2公开(公告)日: 2015-07-07
- 发明人: Seok Hyun Yoon , Byoung Hwa Lee , Chang Hoon Kim , Sang Hoon Kwon
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon, Gyunggi-Do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon, Gyunggi-Do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2012-0079526 20120720
- 主分类号: H01G4/12
- IPC分类号: H01G4/12 ; H01G4/30
摘要:
There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T≦t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7≦Dc/Da≦1.5 is satisfied.
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