Invention Grant
- Patent Title: Laminated ceramic electronic component having a cover layer with dielectric grains and method of fabricating the same
- Patent Title (中): 具有电介质晶粒的覆盖层的层叠陶瓷电子部件及其制造方法
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Application No.: US13839781Application Date: 2013-03-15
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Publication No.: US09076596B2Publication Date: 2015-07-07
- Inventor: Seok Hyun Yoon , Byoung Hwa Lee , Chang Hoon Kim , Sang Hoon Kwon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0079526 20120720
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/30

Abstract:
There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T≦t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7≦Dc/Da≦1.5 is satisfied.
Public/Granted literature
- US20140022692A1 LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME Public/Granted day:2014-01-23
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