CERAMIC ELECTRONIC COMPONENT
    2.
    发明申请

    公开(公告)号:US20220399165A1

    公开(公告)日:2022-12-15

    申请号:US17740769

    申请日:2022-05-10

    摘要: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.

    Multilayer ceramic capacitor and method of manufacturing the same

    公开(公告)号:US11380490B2

    公开(公告)日:2022-07-05

    申请号:US16877902

    申请日:2020-05-19

    摘要: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a plurality of first and second internal electrodes disposed inside the ceramic body, exposed to the first and second surfaces, and having ends exposed to the third or fourth surface, and a first side margin portion and a second side margin portion disposed on side portions of the plurality of first and second internal electrodes exposed to the first and second surfaces. A ratio Db/Da satisfies 1.00 to 1.07, inclusive, where ‘Db’ is a distance, in a stacking direction of the dielectric layer, between both end points of respective edge regions of the first side margin portion and the second side margin portion, and ‘Da’ is a distance in a central region of the ceramic body in the stacking direction.

    Laminated ceramic electronic component having a cover layer with dielectric grains and method of fabricating the same
    7.
    发明授权
    Laminated ceramic electronic component having a cover layer with dielectric grains and method of fabricating the same 有权
    具有电介质晶粒的覆盖层的层叠陶瓷电子部件及其制造方法

    公开(公告)号:US09076596B2

    公开(公告)日:2015-07-07

    申请号:US13839781

    申请日:2013-03-15

    IPC分类号: H01G4/12 H01G4/30

    CPC分类号: H01G4/12 H01G4/1227 H01G4/30

    摘要: There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T≦t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7≦Dc/Da≦1.5 is satisfied.

    摘要翻译: 提供层叠陶瓷电子部件及其制造方法。 层叠陶瓷电子部件包括:陶瓷体,其包括电介质层; 以及第一和第二内部电极,所述第一和第二内部电极彼此相对设置,所述陶瓷体在陶瓷体内具有介电层,其中所述陶瓷体包括作为电容形成部的有源层和形成为非电容形成部的覆盖层 在有源层的上表面和底面中的至少一个上,并且当陶瓷体的厚度为t且覆盖层的厚度为T时,满足T< 1l; t×0.05,并且当平均粒径 在有源层中的电介质晶粒为Da,并且覆盖层中的电介质晶粒的平均粒径为Dc,0.7≦̸ Dc / Da≦̸ 1.5。