Invention Grant
US09076787B2 Fabrication of nickel free silicide for semiconductor contact metallization 有权
用于半导体接触金属化的无镍硅化物的制造

Fabrication of nickel free silicide for semiconductor contact metallization
Abstract:
A semiconductor device with an n-type transistor and a p-type transistor having an active region is provided. The active region further includes two adjacent gate structures. A portion of a dielectric layer between the two adjacent gate structures is selectively removed to form a contact opening having a bottom and sidewalls over the active region. A bilayer liner is selectively provided within the contact opening in the n-type transistor and a monolayer liner is provided within the contact opening in the p-type transistor. The contact opening in the n-type transistor and p-type transistor is filled with contact material. The monolayer liner is treated to form a silicide lacking nickel in the p-type transistor.
Information query
Patent Agency Ranking
0/0