Invention Grant
US09076787B2 Fabrication of nickel free silicide for semiconductor contact metallization
有权
用于半导体接触金属化的无镍硅化物的制造
- Patent Title: Fabrication of nickel free silicide for semiconductor contact metallization
- Patent Title (中): 用于半导体接触金属化的无镍硅化物的制造
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Application No.: US14536737Application Date: 2014-11-10
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Publication No.: US09076787B2Publication Date: 2015-07-07
- Inventor: Derya Deniz
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Agent Nicholas Mesiti, Esq.
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L21/283 ; H01L29/45 ; H01L29/78

Abstract:
A semiconductor device with an n-type transistor and a p-type transistor having an active region is provided. The active region further includes two adjacent gate structures. A portion of a dielectric layer between the two adjacent gate structures is selectively removed to form a contact opening having a bottom and sidewalls over the active region. A bilayer liner is selectively provided within the contact opening in the n-type transistor and a monolayer liner is provided within the contact opening in the p-type transistor. The contact opening in the n-type transistor and p-type transistor is filled with contact material. The monolayer liner is treated to form a silicide lacking nickel in the p-type transistor.
Public/Granted literature
- US20150061032A1 FABRICATION OF NICKEL FREE SILICIDE FOR SEMICONDUCTOR CONTACT METALLIZATION Public/Granted day:2015-03-05
Information query
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