发明授权
US09079376B2 Prepreg, laminate obtained with the same and printed-wiring board
有权
预浸料，用相同和印刷电路板获得的层压板
- 专利标题： Prepreg, laminate obtained with the same and printed-wiring board
- 专利标题（中）： 预浸料，用相同和印刷电路板获得的层压板
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申请号： US13352783申请日： 2012-01-18
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公开(公告)号： US09079376B2公开(公告)日： 2015-07-14
- 发明人: Tomohiko Kotake , Masato Miyatake , Shunsuke Nagai , Hiroyuki Izumi , Shinji Tsuchikawa , Shin Takanezawa , Hikari Murai
- 申请人： Tomohiko Kotake , Masato Miyatake , Shunsuke Nagai , Hiroyuki Izumi , Shinji Tsuchikawa , Shin Takanezawa , Hikari Murai
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Fitch Even Tabin & Flannery
- 主分类号： B32B17/00
- IPC分类号： B32B17/00 ; B32B17/02 ; B32B25/20 ; B32B5/26 ; B32B5/28 ; B32B15/14 ; B32B15/20 ; C08J5/24
摘要：
Disclosed is a prepreg including a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of a thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure.A prepreg having excellent low thermal expansion properties and warpage characteristics which are difficult to be realized by using only a conventional resin which is effective for highly filling an inorganic filler or has a low coefficient of thermal expansion, and a laminate using the same, and a printed wiring board can be provided.