Invention Grant
US09080969B2 Backside CMOS compatible BioFET with no plasma induced damage
有权
背面CMOS兼容的BioFET,无等离子体损伤
- Patent Title: Backside CMOS compatible BioFET with no plasma induced damage
- Patent Title (中): 背面CMOS兼容的BioFET,无等离子体损伤
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Application No.: US14281100Application Date: 2014-05-19
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Publication No.: US09080969B2Publication Date: 2015-07-14
- Inventor: Yi-Shao Liu , Chun-Ren Cheng , Ching-Ray Chen , Yi-Hsien Chang , Fei-Lung Lai , Chun-Wen Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: G01N27/403
- IPC: G01N27/403 ; G01N27/414 ; H01L29/66

Abstract:
The present disclosure provides a bio-field effect transistor (BioFET) device and methods of fabricating a BioFET and a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a gate structure disposed on a first surface of a substrate and an interface layer formed on a second surface of the substrate. The substrate is thinned from the second surface to expose a channel region before forming the interface layer.
Public/Granted literature
- US20140252421A1 Backside CMOS Compatible BioFET with No Plasma Induced Damage Public/Granted day:2014-09-11
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