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    METHOD FOR FORMING BIOCHIPS AND BIOCHIPS WITH NON-ORGANIC LANDINGS FOR IMPROVED THERMAL BUDGET
    2.
    发明申请
    METHOD FOR FORMING BIOCHIPS AND BIOCHIPS WITH NON-ORGANIC LANDINGS FOR IMPROVED THERMAL BUDGET 有权
    用于改善热量预算的生物化学和生物化学方法与非有机土地的形成

    公开(公告)号：US20140273281A1

    公开(公告)日：2014-09-18

    申请号：US13801182

    申请日：2013-03-13

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Chia-Hua Chu ,  Allen Timothy Chang ,  Ching-Ray Chen ,  Yi-Hsien Chang ,  Yi-Shao Liu ,  Chun-Ren Cheng ,  Chun-Wen Cheng

    IPC: G01N33/543

    CPC classification number: G01N33/54386 ,  H01L21/00 ,  H01L2224/18

    Abstract: The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates.

    Abstract translation: 本公开提供了生物芯片和制造生物芯片的方法。 该方法包括组合三个部分：透明衬底，其中具有微流体通道的第一衬底和第二衬底。 用于入口和出口的通孔形成在透明基板或第二基板中。 在组合之前，在第一基板和第二基板上形成具有用于附着生物材料的支撑介质的各种非有机着陆。 在其他实施例中，微流体通道由透明基板和第二基板之间的粘合层形成，在基板上具有着陆。

    BioMEMS and planar light circuit with integrated package
    5.
    发明授权
    BioMEMS and planar light circuit with integrated package 有权
    BioMEMS和具有集成封装的平面光电路

    公开(公告)号：US09034678B2

    公开(公告)日：2015-05-19

    申请号：US14444586

    申请日：2014-07-28

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Allen Timothy Chang ,  Yi-Shao Liu ,  Ching-Ray Chen ,  Chun-Ren Cheng

    IPC: H01L21/00 ,  G01N21/64 ,  H01L23/02 ,  H01L23/00

    CPC classification number: G01N21/648 ,  G01N21/6454 ,  H01L23/02 ,  H01L24/80 ,  H01L2924/12042 ,  H01L2924/12043 ,  Y10T156/10 ,  H01L2924/00

    Abstract: A BioMEMS microelectromechanical apparatus and for fabricating the same is disclosed. A substrate is provided with at least one signal conduit formed on the substrate. A sacrificial layer of sacrificial material may be deposited on the signal conduit and optionally patterned to remove sacrificial material from outside the packaging covered area. A bonding layer may be deposited on at least a portion of the signal conduit and on the sacrificial layer when included. The bonding layer may be planarized and patterned to form one or more cap bonding pads and define a packaging covered area. A cap may be bonded on the cap bonding pad to define a capped area and so that the signal conduit extends from outside the capped area to inside the capped area. Additionally, a test material such as a fluid may be provided within the capped area.

    Abstract translation: 公开了一种BioMEMS微机电装置及其制造方法。 衬底上设置有形成在衬底上的至少一个信号导管。 牺牲材料的牺牲层可以沉积在信号导管上，并且可选地被图案化以从包装覆盖区域的外部去除牺牲材料。 当包括的时候，粘结层可沉积在信号导管的至少一部分上和牺牲层上。 结合层可以被平坦化和图案化以形成一个或多个帽接合焊盘并限定包装覆盖区域。 帽可以结合在盖接合垫上以限定封盖区域，并且使得信号导管从封盖区域的外部延伸到封盖区域的内部。 此外，可以在封盖区域内设置诸如流体的测试材料。

    Backside CMOS compatible bioFET with no plasma induced damage
    6.
    发明授权
    Backside CMOS compatible bioFET with no plasma induced damage 有权
    背面CMOS兼容的bioFET，没有等离子体引起的损坏

    公开(公告)号：US08728844B1

    公开(公告)日：2014-05-20

    申请号：US13706002

    申请日：2012-12-05

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Yi-Shao Liu ,  Chun-Ren Cheng ,  Ching-Ray Chen ,  Yi-Hsien Chang ,  Fei-Lung Lai ,  Chun-Wen Cheng

    IPC: H01L21/00

    CPC classification number: G01N27/4145 ,  G01N27/4148 ,  H01L21/31105 ,  H01L27/088 ,  H01L29/66477

    Abstract: The present disclosure provides a bio-field effect transistor (BioFET) device and methods of fabricating a BioFET and a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a gate structure disposed on a first surface of a substrate and an interface layer formed on a second surface of the substrate. The substrate is thinned from the second surface to expose a channel region before forming the interface layer.

    Abstract translation: 本公开提供了生物场效应晶体管（BioFET）器件和制造BioFET和BioFET器件的方法。 该方法包括使用与互补金属氧化物半导体（CMOS）工艺兼容或典型的一个或多个工艺步骤形成BioFET。 BioFET器件包括设置在衬底的第一表面上的栅极结构和形成在衬底的第二表面上的界面层。 在形成界面层之前，从第二表面减薄衬底以暴露沟道区。

    Backside CMOS Compatible BioFET With No Plasma Induced Damage
    8.
    发明申请
    Backside CMOS Compatible BioFET With No Plasma Induced Damage 审中-公开
    背面CMOS兼容的BioFET，无等离子体诱发损伤

    公开(公告)号：US20160011144A1

    公开(公告)日：2016-01-14

    申请号：US14799453

    申请日：2015-07-14

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Yi-Shao Liu ,  Chun-Ren Cheng ,  Ching-Ray Chen ,  Yi-Hsien Chang ,  Fei-Lung Lai ,  Chun-Wen Cheng

    IPC: G01N27/414 ,  H01L21/311 ,  H01L29/66

    CPC classification number: G01N27/4145 ,  G01N27/4148 ,  H01L21/31105 ,  H01L27/088 ,  H01L29/66477

    Abstract: The present disclosure provides a bio-field effect transistor (BioFET) device and methods of fabricating a BioFET and a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a gate structure disposed on a first surface of a substrate and an interface layer formed on a second surface of the substrate. The substrate is thinned from the second surface to expose a channel region before forming the interface layer.

    Abstract translation: 本公开提供了生物场效应晶体管（BioFET）器件和制造BioFET和BioFET器件的方法。 该方法包括使用与互补金属氧化物半导体（CMOS）工艺兼容或典型的一个或多个工艺步骤形成BioFET。 BioFET器件包括设置在衬底的第一表面上的栅极结构和形成在衬底的第二表面上的界面层。 在形成界面层之前，从第二表面减薄衬底以暴露沟道区。

    Method for forming biochips and biochips with non-organic landings for improved thermal budget
    9.
    发明授权
    Method for forming biochips and biochips with non-organic landings for improved thermal budget 有权
    用于形成具有非有机上光的生物芯片和生物芯片以提高热预算的方法

    公开(公告)号：US08846416B1

    公开(公告)日：2014-09-30

    申请号：US13801182

    申请日：2013-03-13

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Chia-Hua Chu ,  Allen Timothy Chang ,  Ching-Ray Chen ,  Yi-Hsien Chang ,  Yi-Shao Liu ,  Chun-Ren Cheng ,  Chun-Wen Cheng

    IPC: H01L21/00 ,  G01N33/543

    CPC classification number: G01N33/54386 ,  H01L21/00 ,  H01L2224/18

    Abstract: The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates.

    Abstract translation: 本公开提供了生物芯片和制造生物芯片的方法。 该方法包括组合三个部分：透明衬底，其中具有微流体通道的第一衬底和第二衬底。 用于入口和出口的通孔形成在透明基板或第二基板中。 在组合之前，在第一基板和第二基板上形成具有用于附着生物材料的支撑介质的各种非有机着陆。 在其他实施例中，微流体通道由透明基板和第二基板之间的粘合层形成，在基板上具有着陆。

    Microelectromechanical device with integrated package
    10.
    发明授权
    Microelectromechanical device with integrated package 有权
    具有集成封装的微机电装置

    公开(公告)号：US08791557B2

    公开(公告)日：2014-07-29

    申请号：US13652999

    申请日：2012-10-16

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Allen Timothy Chang ,  Yi-Shao Liu ,  Ching-Ray Chen ,  Chun-Ren Cheng

    IPC: H01L23/02

    CPC classification number: G01N21/648 ,  G01N21/6454 ,  H01L23/02 ,  H01L24/80 ,  H01L2924/12042 ,  H01L2924/12043 ,  Y10T156/10 ,  H01L2924/00

    Abstract: A BioMEMS microelectromechanical apparatus and for fabricating the same is disclosed. A substrate is provided with at least one signal conduit formed on the substrate. A sacrificial layer of sacrificial material may be deposited on the signal conduit and optionally patterned to remove sacrificial material from outside the packaging covered area. A bonding layer may be deposited on at least a portion of the signal conduit and on the sacrificial layer when included. The bonding layer may be planarized and patterned to form one or more cap bonding pads and define a packaging covered area. A cap may be bonded on the cap bonding pad to define a capped area and so that the signal conduit extends from outside the capped area to inside the capped area. Additionally, a test material such as a fluid may be provided within the capped area.

    Abstract translation: 公开了一种BioMEMS微机电装置及其制造方法。 衬底上设置有形成在衬底上的至少一个信号导管。 牺牲材料的牺牲层可以沉积在信号导管上，并且可选地被图案化以从包装覆盖区域的外部去除牺牲材料。 当包括的时候，粘结层可沉积在信号导管的至少一部分上和牺牲层上。 结合层可以被平坦化和图案化以形成一个或多个帽接合焊盘并限定包装覆盖区域。 帽可以结合在盖接合垫上以限定封盖区域，并且使得信号导管从封盖区域的外部延伸到封盖区域的内部。 此外，可以在封盖区域内设置诸如流体的测试材料。

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