Invention Grant
- Patent Title: System and method to design and test a yield sensitive circuit
- Patent Title (中): 设计和测试屈服敏感电路的系统和方法
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Application No.: US13757635Application Date: 2013-02-01
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Publication No.: US09081932B2Publication Date: 2015-07-14
- Inventor: Hongmei Liao , Karim Arabi
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Arent Fox LLP
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G01R31/3185 ; H01L21/66 ; G06F11/267

Abstract:
A method includes identifying at least a portion of a design of a semiconductor device to be fabricated as a yield sensitive circuit. The method also includes, in response to identifying the yield sensitive circuit, forming a scan chain. Forming the scan chain includes inserting the yield sensitive circuit between a pair of flip flops and connecting the yield sensitive circuit to the pair of flip flops.
Public/Granted literature
- US20140223389A1 SYSTEM AND METHOD TO DESIGN AND TEST A YIELD SENSITIVE CIRCUIT Public/Granted day:2014-08-07
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