Embodiments of the present invention disclose a method for encapsulating a component with plastic and its encapsulation structure, which belong to the plastic encapsulation technology field. The method includes: processing, by using the surface mounting technology, a first surface of a part to be encapsulated with plastic and/or performing die bonding on the first surface; encapsulating, with plastic, the first surface of the part to be encapsulated with plastic a second surface of the part to be encapsulated with plastic the first surface and/or performing die bonding in the second face; and encapsulating, with plastic, the second surface of the part to be encapsulated with plastic. This encapsulation structure includes a substrate, where components are fixed on an upper surface and a lower surface of the substrate, and the components on the upper surface and lower surface are all encapsulated with plastic in seal.